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Primary Duties:
<!--[if !supportLists]-->1.
<!--[endif]-->Explore and development new/ advanced material, process and
equipment in FCBGA/ FCLGA/ FCPGA/ FCCSP in multiple chip package and 3D
package.
<!--[if !supportLists]-->2.
<!--[endif]-->Support product/product NPI in feasibility, characterization and
qualification.
<!--[if !supportLists]-->3.
<!--[endif]-->Managed to conduct DOE and optimization for evaluation study.
<!--[if !supportLists]-->4.
<!--[endif]-->Initiate/implement continuous improvement projects, process optimization
and characterization for continual improvement.
<!--[if !supportLists]-->5.
<!--[endif]-->Drive yield, quality and productivity improvement program.
<!--[if !supportLists]-->6.
<!--[endif]-->Drive investigation, root cause/failure analysis for internal
and external quality escapee issues in 4D/ 8D approach.
<!--[if !supportLists]-->7.
<!--[endif]-->Update and generate documentation for process-related changes.
<!--[if !supportLists]-->8.
<!--[endif]-->System and machine basic troubleshooting.
<!--[if !supportLists]-->9.
<!--[endif]-->Drive process cost saving and simplification projects
<!--[if !supportLists]-->10.
<!--[endif]-->Develop and establish assembly processes recipe for new products
through process characterization and process parameters optimization.
<!--[if !supportLists]-->11.
<!--[endif]-->Drive cost saving and process Cost Of Ownership (COO)
improvement through material selection, process cycle time improvement,
productivity improvement/innovation
<!--[if !supportLists]-->12.
<!--[endif]-->Other duties assigned by superior.
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